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Steinmetz

Firmware Engineer

San Francisco, CA, US · Not specified

Annual base salary
$100k – $175k USD
Equity
Not disclosed
Commitment
Full Time
Company stage
Not disclosed

Compensation as listed

$100K - $175K

About Steinmetz

Steinmetz is building the next generation of American power electronics. The next generation of great machines — electric vehicles, robotics, aerospace, and industrial systems — depends on power electronics that are lighter, cheaper, more efficient, and built at real scale.

About the role

Steinmetz is hiring a firmware engineer for a new power electronics product we’re bringing to market.

At Steinmetz we deal with incredible challenges, and we have a very high-bar for talent. The ideal person for this role is someone who can take ownership and execute, the type of person who when faced with a challenge can work to find a solution.

What You’ll Do

  • Write Rust firmware for resource-constrained microcontrollers
  • Design and validate high-frequency power electronics control loops
  • Design and bring up the software integration for our hardware test suites
  • Work on test fixtures for our manufacturing line

Must-Haves

  • Experience in Rust programming
  • Understanding of firmware fundamentals
  • Ability to learn quickly
  • Resilience

Technology

Steinmetz builds high-power electric propulsion and power-conversion hardware end-to-end: from semiconductor packaging and gate-drive electronics through firmware, controls, thermal/mechanical design, and MW-scale validation.

We are tool-agnostic and use whatever gets the design to real hardware fastest. A sample of the problems we work on:

Software / Firmware

  • Rust firmware for embedded power electronics
  • 100 kHz-class switching controls, protection loops, and fault handling
  • Hardware-in-the-loop testing, telemetry, calibration, and automated bring-up

Electrical / Power Electronics

  • MW-scale power electronics simulation, test, and validation
  • Nanosecond-scale semiconductor switching and high-dv/dt design
  • Custom chip / power-module packaging
  • Gate-drive, sensing, isolation, EMI/EMC, and fault-protection hardware

Mechanical / Thermal

  • Thermal management for high-power systems, including vacuum environments
  • Lightweight mechanical structures for high-vibration platforms: aircraft, cars, rockets, boats, etc.
  • Aluminum structures, busbars, enclosures, cooling paths, and manufacturable packaging

Test / Manufacturing

  • Custom test stands for high-voltage, high-current hardware
  • Rapid prototyping across PCBAs, machined parts, harnesses, and assemblies
  • Design-for-test and design-for-manufacturing on real production-intent hardware

Source: Y Combinator. Confirm availability with the employer.

Apply through the original posting.

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